Batch
Convection Reflow Soldering System MRO250
Product information
The batch soldering system with microprocessor control for laboratory and small series is the ideal solution for everyday use and combines easy handling with a low price. The user-friendly interface enables quick and uncomplicated programming of individual soldering programs to reduce set-up times to a minimum.
The MRO250 can solder a PCB size of up to 350 x 250 mm and is easily transportable due to its low weight and handy dimensions.
Technical Specifications
- Dimensions: 590 x 260 x 430 mm
- Max. PCB size: 350 x 250 mm
- Preheating-temperature / time: 50 - 240°C, 1 - 3600 sec.
- Reflow-temperature / time: 75 - 320°C, 1 - 600 sec.
- long-time process (e. g. b. cure adhesive): 50 - 180°C, 1 - 300 min.
