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Convection Reflow Soldering System MRO250

Product information

The batch soldering system with microprocessor control for use in the laboratory and small-scale production is the ideal solution for daily use. It combines ease of handling with an attractive price level. The user-friendly interface allows for quick and uncomplicated programming of individual soldering profiles, thereby reducing setup times to a minimum. The MRO250 processes printed circuit boards up to a size of 350 × 250 mm. Thanks to its low weight as well as its compact and handy design, the system is also easily transportable at any time.

Technical Specifications

  • Dimensions: 590 x 430 x 305 mm
  • Max. PCB size: 350 x 250 mm
  • Preheating-temperature / time: 50 - 240°C, 1 - 3600 sec.
  • Reflow-temperature / time: 75 - 320°C, 1 - 600 sec.
  • long-time process (e. g. b. cure adhesive): 50 - 180°C, 1 - 300 min.

Additional information